André B. Oliveira, born in 24 of May 1997, has finished his MSc. degree in Electronics Engineering from Instituto Superior Técnico (IST), University of Lisbon in 2021 with the final classification of 16 out of 20. His MSc. Thesis focused on developing an Eddy Current Testing (ECT) array probe for metal additive manufacturing imaging and was graded 19 out of 20 values. André has engaged in scientific research since early stage being the co-author of the paper "Designing an Eddy Current Testing Structural Health Monitoring Instrument" published in an international conference on which he contributed to complete the instrument, performing the reported measurements and to the manuscript redaction. He is actively involved in other research efforts being the co-author of two other manuscripts: "Low-Cost Multi-Frequency Eddy Current Coating Thickness Measurement System" waiting publication in an international conference paper for which he contributed performing the reported results and on the manuscript redaction; “Improving Eddy Current Testing Array Probes Scalability for Powder Bed Fusion Layer-Wise Imaging” submitted to the IEEE Transactions on Industrial Electronics with the main results of his MSc. Thesis. André is also the co-inventor of a potential patent "Single-phase heterodyning readout of magnetoresistive sensors for eddy current testing" submitted for appreciation to the IST Intellectual Property office. While proceeding towards the MSc. degree, André has worked with the Siemens SA, Bus Charging Team, developing Artificial Intelligence algorithms to reduce Electrical Vehicles charging costs. Also, and throughout the last three months of his MSc., he collaborated as a lecture assistant for the laboratory classes of the Electronic Integrated Systems and the Programmable Electronic Systems courses offered to Electronics Engineering MSc. students at IST. He is currently engaged as a researcher at the Instrumentation and Measurements Group (GIM) of Instituto de Telecomunicações (IT), carrying research on exploring different contactless electromagnetic methods for layer-wise testing of powder bed fusion metal additive manufacturing.